3M™ Sondhi™ Rapid-Set Indirect Bonding Adhesive Resin B
solventum · Quelle
Herstellertext auf Englisch
The Sondhi™ Rapid-Set Indirect Bonding Adhesive is revolutionary from every angle. Lightly filled resins cure chemically in half the time of other indirect adhesives, while achieving two-thirds of its bond strength within the first five minutes.
- Less bracket repositioning
- More control and accurate bracket placement second molar to second molar
- No mixing of Resin A & B required
Produktinformationen
| Hersteller | solventum |
|---|---|
| Category | Orthodontic Bonding |
| Packungsgröße | 10 ml |