Quick Seal

B.J.M. Laboratories Ltd. · #100130 · source

Self-etch light-cure pit & fissure sealant

A self-etch, single step, single component material - no etching, rinsing or drying needed! Simplifies and shortens the clinical procedure.
ISO 4049 classification: Type 2, Class 2.
Bonds to enamel without etching.
Easy and precise application by using direct syringe technique.
Compatible with all curing units available on the market.
Low viscosity, excellent flow properties, optimal wetting of fissures.
Depth of cure is > 5 mm.
Marketed since 2006 with no changes in formula. No complaints of any health-related or chemical performance issues were received.

Flexural strength: >50, in the 150 – 200 MPa interval.

Shore D hardness: >80

Solubility: ≤7.5 μg/mm3

Water sorption: ≤40 μg/mm3

Light curing time: 10 – 20 seconds

Bond Strength to etched enamel: >15 MPa, in the 30 – 35 MPa interval

Bond Strength to un-etched enamel: >10 MPa, in the 10 – 15 MPa interval

pH: < 4

Sensitivity to ambient light: ~75 sec

Film thickness: ≤50 μm

Compatible with LED: Yes

Compatible with halogen light: Yes

Compatible with plasma ark light lamp: Yes

Shelf life: 2 Years

Manufacturer	B.J.M. Laboratories Ltd.
pH	< 4
Type	Self-etch light-cure pit & fissure sealant
Shelf Life	2 Years
Solubility	≤7.5 μg/mm3
Depth Of Cure	> 5 mm
Film Thickness	≤50 μm
Water Sorption	≤40 μg/mm3
Package Contents	2 Syringes 1.2ml (1.4g) each
Shore D Hardness	>80
Flexural strength	>50, in the 150 – 200 MPa interval
Light Curing Time	10 – 20 seconds
Compatible With Led	Yes
Iso 4049 Classification	Type 2, Class 2
Dispensing Tips Included	4
Sensitivity To Ambient Light	~75 sec
Compatible With Halogen Light	Yes
Bond Strength To Etched Enamel	>15 MPa, in the 30 – 35 MPa interval
Bond Strength To Un Etched Enamel	>10 MPa, in the 10 – 15 MPa interval
Compatible With Plasma Arc Light Lamp	Yes
Compatible With Plasma Ark Light Lamp	Yes