All-Bond 3® Bottle Kit with Uni-Etch® w/BAC

Bisco, Inc. · #B-36200K · source

Universal Dental Adhesive System All-Bond 3 micro-mechanically bonds to substrates and is compatible with light-, dual-, and self-cured materials with the total-etch bonding technique. The All-Bond 3 system offers increased hydrophobicity for a long-lasting bond*. All-Bond 3 is HEMA-free and radiopaque, reducing the chance of misdiagnosing caries. All-Bond 3 Part A&B Bottle Set can provide approximately 232 restorations (1:1 ratio). The kit includes:

Uni-Etch w/BAC – A 32% semi-gel phosphoric acid etchant available with Benzalkonium Chloride (BAC) to be used with All-Bond 3 in the total-etch technique All-Bond 3 Part A and Part B – Allows for All-Bond 3 to be dual-cured All-Bond 3 Resin – Creates a radiopaque layer distinguishable on X-rays to avoid misdiagnosis

Unique Benefits:

Compatible with light-, self- and dual-cured materials (without the use of additional activators)

Only 1-2 coats of Part A&B are required

Clinical Significance:

All-Bond 3 Resin is radiopaque allowing visibility on radiographs in areas where adhesives commonly pool, reducing the risk of misdiagnosing caries

   

Informations produit

FabricantBisco, Inc.
HemaSans HEMA
TypeDual-cured, universal dental adhesive system
SolventEthanol-based
TechniqueTotal-etch bonding technique
RadiopaqueOui
Shelf Life2 years
ApplicationApproximately 232 restorations (1:1 ratio)
Resin Volume4ml
CompatibilitéCompatible with all light-, self-, and dual-cured materials
Part A Volume6ml
Part B Volume6ml
RefrigerationNon requis
Coats Required1-2 coats
Film Thickness5-10µm
HydrophobicityIncreased
Storage TemperatureRoom temperature (20°C/68°F - 25°C/77°F)
Compatible MaterialsLight-cured, self-cured, and dual-cured materials
Uni Etch W/bac Volume5g
Cure Time (halogen/led)10 seconds