All-Bond 3® Bottle Kit with Uni-Etch® w/BAC
Bisco, Inc. · #B-36200K · source
Universal Dental Adhesive System All-Bond 3 micro-mechanically bonds to substrates and is compatible with light-, dual-, and self-cured materials with the total-etch bonding technique. The All-Bond 3 system offers increased hydrophobicity for a long-lasting bond*. All-Bond 3 is HEMA-free and radiopaque, reducing the chance of misdiagnosing caries. All-Bond 3 Part A&B Bottle Set can provide approximately 232 restorations (1:1 ratio). The kit includes:
Uni-Etch w/BAC – A 32% semi-gel phosphoric acid etchant available with Benzalkonium Chloride (BAC) to be used with All-Bond 3 in the total-etch technique All-Bond 3 Part A and Part B – Allows for All-Bond 3 to be dual-cured All-Bond 3 Resin – Creates a radiopaque layer distinguishable on X-rays to avoid misdiagnosis
Unique Benefits:
Compatible with light-, self- and dual-cured materials (without the use of additional activators)
Only 1-2 coats of Part A&B are required
Clinical Significance:
All-Bond 3 Resin is radiopaque allowing visibility on radiographs in areas where adhesives commonly pool, reducing the risk of misdiagnosing caries
Informations produit
| Fabricant | Bisco, Inc. |
|---|---|
| Hema | Sans HEMA |
| Type | Dual-cured, universal dental adhesive system |
| Solvent | Ethanol-based |
| Technique | Total-etch bonding technique |
| Radiopaque | Oui |
| Shelf Life | 2 years |
| Application | Approximately 232 restorations (1:1 ratio) |
| Resin Volume | 4ml |
| Compatibilité | Compatible with all light-, self-, and dual-cured materials |
| Part A Volume | 6ml |
| Part B Volume | 6ml |
| Refrigeration | Non requis |
| Coats Required | 1-2 coats |
| Film Thickness | 5-10µm |
| Hydrophobicity | Increased |
| Storage Temperature | Room temperature (20°C/68°F - 25°C/77°F) |
| Compatible Materials | Light-cured, self-cured, and dual-cured materials |
| Uni Etch W/bac Volume | 5g |
| Cure Time (halogen/led) | 10 seconds |