High-Q-Bond Bracket
B.J.M. Laboratories Ltd. · source
Light-cure bracket adhesive system
Direct bonding of metal and ceramic orthodontic brackets to tooth surfaces
Properties
- Bonds chemically and mechanically for a superior bond, while flowing into the tightest mesh without bracket drift.
- A light-cure material - compatible with all curing units available on the market.
- Depth of cure is > 4 mm.
- Glass filled material designed specifically for orthodontic use that allows maximum penetration of filler into the finest screen mesh base.
- The viscosity of High-Q-Bond Bracket was designed to prevent adhesive run-on and bracket skating.
- Marketed since 2007 with no changes in formula. No complaints of any health-related or chemical performance issues were received.
Technical Data
Adhesive bonding to etched enamel: >15 MPa, in the 30 – 35 MPa interval. Adhesive bonding to pretreated metal surface: > 10 MPa. Adhesive bonding to pretreated porcelain surfaces: > 5 MPa. Flexural strength: >50, in the 100 – 150 MPa interval. Solubility: ≤7.5 μg/mm³ Water sorption: ≤40 μg/mm³ Light curing time: 10 – 20 seconds Film thickness: ≤50 μm Compatible with LED: Yes Compatible with halogen light: Yes Compatible with plasma arc light lamp: Yes Shelf life: 2 Years
Informations produit
| Fabricant | B.J.M. Laboratories Ltd. |
|---|---|
| Shelf Life | 2 Years |
| Solubility | ≤7.5 μg/mm³ |
| Film Thickness | ≤50 μm |
| Water Sorption | ≤40 μg/mm³ |
| Résistance à la flexion | >50, in the 100 – 150 MPa interval |
| Light Curing Time | 10 – 20 seconds |
| Compatible With Led | Oui |
| Compatible With Halogen Light | Oui |
| Adhesive Bonding To Etched Enamel | >15 MPa, in the 30 – 35 MPa interval |
| Compatible With Plasma Arc Light Lamp | Oui |
| Adhesive Bonding To Pretreated Metal Surface | > 10 MPa |
| Adhesive Bonding To Pretreated Porcelain Surfaces | > 5 MPa |
