HITZLOS Abrasive Wheels (Dental Technology)
Busch & Co.
HITZLOS silicon carbide (SiC) abrasive wheels for heatless and dry grinding of ceramics and metal alloys. Magnesite bond, unmounted, centre hole 1.8mm. Thickness 2.0/3.0/4.5mm, grit size medium, bonding hardness soft. Dry grinding only, no disinfection or sterilization, dry storage.
Informations produit
| Fabricant | Busch & Co. |
|---|---|
| Bond | Magnesite |
| Granulométrie | Moyen |
| Matériau | Silicon Carbide (SiC) |
| Centre Hole | 1.8 mm |
| Thicknesses | 2.0, 3.0, 4.5 mm |
| Gamme de produits | HITZLOS |
| Bonding Hardness | Souple |
